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Company Trend（Feb. 27）Samsung unveils HBM with highest-capacity to dateSamsung Electronics announced recently that it has developed a new high-bandwidth memory chip that has broken the record of “capacity” in the industry and will be mainly used i…

企业动态（2月27日）三星，发布迄今为止容量最高的 HBM三星电子近日宣布，成功研发出一款新型高带宽存储芯片，该芯片在业界“刷新了容量纪录”，主要应用于智能手机、电脑等消费类设备。这款名为HBM3E12H的芯片，采用12层堆叠设计，但通过创新的热压非导电薄膜技术，实现…

01Company Trend (Feb. 20) ARM and Samsung are working together for 2nm chips Samsung Electronics announced that it will work with ARM, the world’s leading semiconductor IP company, to optimize the design of next-gen Cortex-A and Cortex-X CPU cores t…

01企业动态（2月20日）三星和Arm，合作2nm 三星电子宣布，将与全球行动装置矽智财(IP)龙头安谋一同将次世代Cortex-A、Cortex-X通用处理器核心的设计，针对三星的次世代2纳米GAA制程最佳化。 20日新闻消息指出，三星即将问世的制程技术，是基于「环绕式闸极」(gate-all-ar…

Company Trend(Feb. 4th)SK Hynix plans to build HBM plant in USA to help make AI chipsRecently, two insiders revealed that SK Hynix, a Korean storage chip manufacturer, plans to build an advanced packaging plant in Indiana, USA to produce HBM chips whi…

01 企业动态（2月4日）SK海力士计划赴美建HBM工厂，助力AI芯片美国制造！近日，两名知情人士透露，韩国存储芯片制造商SK海力士计划在美国印第安纳州建立先进封装工厂，生产高带宽內存（HBM）芯片，以便与英伟达（NVIDIA）的AI GPU进行整合，实现AI芯片的美国制造。显然，…